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Front End Central Product Integration (FE cPIE) MTS (FE) role at Micron Technology in Singapore, Singapore.

IDMOnsiteFront End

Lead process integration (PI) structural uniformity and cross‑loop integration for critical modules, owning end‑to‑end integration strategies to resolve yield, quality, and reliability gaps.
Drive physics‑ and process‑based integration solutions through close collaboration with cross‑module process owners, PI subject‑matter experts, and key suppliers to optimise integration structures and achieve BIC yield and quality targets.
Develop and apply model‑based root cause analysis frameworks (transport, reaction kinetics, pattern density, and geometry‑dependent effects) to diagnose structural non‑uniformity.
Define, implement, and continuously strengthen critical inline monitoring and defence lines (CD, film loss, mass delta, defectivity, edge/periphery metrics) to ensure robust control of structural uniformity.
Proactively drive node‑over‑node “shift‑left” integration, including early implementation of uniformity, bevel, and backside best‑known‑methods (BKMs) during development phases to accelerate whole‑wafer yield and quality ramp.
Drive worldwide technical alignment and execution excellence by leading global projects, standardising and leveraging network BKMs, and scaling proven solutions across sites.

Bachelor's/Master's/PhD in EE, Materials Engineering, Materials Science, Physics, or Chemical (optional if candidates have 10+ years' experience in a process-related role in the semiconductor industry).
More than 7 years of relevant industry experience/knowledge.
Strong logical thinking and knowledge in Semiconductor Fabrication process flows, including interaction of different processes and how changes affect yield, device performance, and reliability.
Understanding of DRAM and NAND operation and structure to decipher parametric, probe, and qual data from front-end and backend assembly processes.
Proven ability in model‑based problem solving, data‑driven decision making, and addressing root causes of structure and device issues.
Good organizational capabilities and ability to work effectively, including flexibility with job responsibilities and taking initiative.
Strong interpersonal skills and ability to build customer/co-worker relationships.
Good multi‑tasking, verbal, and written communication skills.