Micron Technology

Sr Engineer - CMP Process Development

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeOnsitePosted 3 weeks ago

About the role

AI summarised

Micron’s NAND Process Development (PD) Singapore group is seeking a Process Development Engineer to support Technology Development (TD) activities related to the rapid deployment of technology nodes, process margin improvement, and ensuring extended engagement with manufacturing on upcoming technology nodes. This role focuses heavily on Chemical Mechanical Planarization (CMP) process ownership and advancement for 3D NAND.

IDMOnsiteSTPG

Key Responsibilities

  • Own the process module involving Chemical Mechanical Planarization (CMP) process characterization and advanced process development for 3D NAND and beyond.
  • Collaborate with global teams (Singapore, Boise, US) and vendors to develop processes meeting integration requirements for next-generation 3-D NAND nodes.
  • Transfer CMP processes to high volume manufacturing (Fab10N) and drive continuous manufacturability improvements.
  • Address process issues in partnership with the Fab10N team and key business partners regarding tool choices and evaluations.
  • Conduct fundamental research, consumables development, and hardware evaluation for advanced 3D NAND CMP processes.
  • Initiate and manage experiments to widen process margins and test the manufacturability of next-node solutions.
  • Lead complex, multi-functional projects critical to Micron's success, providing technical counsel to management.
  • Serve as a technical expert contributing to improvements in processes, procedures, and equipment.

Requirements

  • Bachelors’/Masters in Materials Science, Chemical Engineering or Physics with a minimum of 5 years of hands-on experience in groundbreaking CMP polishing equipment (e.g., AMAT or EBARA).
  • Alternatively, a PhD in Materials Science, Chemical Engineering, or Physics.
  • Proven ability to drive process development from early stage through high volume manufacturing transfer.
  • Experience in advanced 3D NAND process development is highly relevant.
  • Strong problem-solving skills applying failure analysis, FMEA, 8D, or SPC/FDC methodologies.
  • Ability to collaborate effectively with global teams and suppliers.