About the role
AI summarisedJoin the High Bandwidth Memory (HBM) Product Engineering Media Health team to drive intrinsic and extrinsic reliability test program coding for Micron’s latest HBM products. This role is pivotal in ensuring product reliability and robustness by developing advanced testing flows to meet critical KPIs regarding Quality, Cost, and Cycle Time.
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Key Responsibilities
- Develop new reliability test flows (e.g., extended wafer level burn in, pWLRx, ELFR) for both DRAM and Interface die and stacked products.
- Perform intrinsic and extrinsic reliability assessment to meet critical Quality, Cost, and Cycle Time KPIs.
- Conduct root cause analysis and resolution for reliability test program related issues.
- Promote innovation by developing new reliability features, solutions, or optimizing code infrastructure to maintain competitive edge.
- Collaborate cross-functionally with Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability teams.
- Utilize in-house statistical tools for engineering data analysis, validation, and risk assessment.
- Define interface hardware specifications and perform validation/debug of new interface boards.
Requirements
- Bachelor's or Master's degree in Electrical & Electronics Engineering, Computer Science, or a related field, or equivalent experience.