About the role
AI summarisedJoin the HIG HBM Package Product Engineering team to lead and develop high-performing activities driving Package and HBM Product engineering. You will be part of a global team focused on next-generation HBM products, critical to achieving KPIs in Quality, Cost, Cycle Time, and Scale.
IDMOnsiteHIG
Key Responsibilities
- Improve assembly-related coverage within manufacturing flows to enhance Time 0 and Field DPM and prevent inline fallout.
- Improve HBM Cube yield through test optimization and coverage by collaborating with Technology Development and Packaging organizations.
- Debug, identify root causes, and drive resolutions for Quality and RMA packaging issues using Electric Failure Analysis (EFA) and Physical Failure Analysis (PFA).
- Establish robust Process Conversion Business Processes with FAB, Technology Development, and Advanced Packaging teams to improve Yield and DPM.
- Provide recommendations for new process conversions to reduce cost and increase yields of HBM products.
- Mentor and develop team members to foster organizational growth.
- Collaborate cross-functionally with Fab, HBM Technology Development, Design, System Development, and Quality/Reliability teams for successful product shipments.
- Promote innovation to maintain a technical competitive advantage in the market.
- Lead project execution and make final decisions regarding risk analysis and project prioritization.
- Collaborate on developing, deploying, and validating AI/ML models to enhance KPIs like Quality, Cost, Cycle Time, and Scale.
Requirements
- Bachelor's/Master's degree in Electrical, Electronic, or Mechanical Engineering.
- Demonstrated competent technical skills in problem-solving with root cause understanding.
- Ability to develop and implement solutions through in-depth circuit analysis.