About the role
AI summarisedAs a Senior Wets Process Development Engineer, you will serve as the technical anchor for our end-to-end wet process portfolio. This role drives the design, optimization, and scaling of advanced plating, etching, cleaning, and stripping processes from lab concept to high-volume manufacturing readiness.
IDMOnsiteProcess Techno & Eqpt. Dev.
Key Responsibilities
- Lead the design and optimization of advanced wet processes, including plating (NiPdAu/ENEPIG), wet etching, resist stripping, and precision cleaning modules.
- Conduct Root Cause Analysis on complex process defects (e.g., thickness non-uniformity, interfacial passivation) using advanced analytical tools.
- Drive the transition of new wet processes from initial lab-scale concepts to robust, high-volume manufacturing (HVM) readiness.
- Evaluate and integrate next-generation chemistries, managing stabilizer systems and additive interactions to improve process margins.
- Design and execute sophisticated multi-variate experiments (DOE) to isolate variables in electrochemical reactions and surface preparation.
- Collaborate cross-functionally with Lithography, PVD, CVD, R&D, and Assembly teams to ensure seamless process compatibility.
Requirements
- Bachelor’s Degree in Chemical Engineering, Materials Science, Chemistry, or related Engineering discipline.
- 5 to 10 years of direct experience in semiconductor process development with a focus on wet station technologies.
- Proven track record in Electroless and Electrolytic plating, including NiPdAu chemistry experience.
- Deep expertise in Wet Etching and Wafer Cleaning processes (SC1/SC2, SPM, advanced solvent chemistries).
- Hands-on experience with Resist Stripping and surface preparation for advanced packaging or FEOL applications.
- Proficiency in Design of Experiments (DOE) and Statistical Process Control (SPC).
- Ability to interpret complex material characterization data regarding chemical stratification or surface poisoning.