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STMicroelectronics

Poly Etch Process Engineer

STMicroelectronics
Integrated Device ManufacturingSingaporeOnsitePosted 3 weeks ago
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About the role

AI summarised

Manage a cost-effective wafer fabrication process by providing engineering support to the production line, taking full ownership of all engineering issues for the assigned trench etch process within the poly team.

IDMOnsiteProcess Engineering

Key Responsibilities

  • Maintain and support day-to-day manufacturing activities through real-time problem analysis and timely implementation of effective solutions.
  • Ensure smooth process flow with high quality, high yield, and low cost by collaborating with various teams.
  • Provide cross-functional, cross-department, and cross-fab support based on operational needs.
  • Take responsibility for trench etch processes within the poly team.
  • Conduct real-time problem analysis for SPC OOC/OOS, defect failures, and FDC failures to determine appropriate solutions.

Requirements

  • Bachelor’s degree in Electrical/Electronics Engineering, Mechanical Engineering, Materials Engineering, Chemical Engineering or a related discipline.
  • Around 2 years of experience with trench etch processes and associated challenges.
  • Experience with profile control and process stability is required.
  • Ability to conduct real-time problem analysis for SPC OOC/OOS, defect failures, and FDC failures.
  • Ability to set up process recipes for newly introduced processes.
  • Ability to establish a robust process control system to maintain low Wafer at Risk (WAR) level.