About the role
AI summarisedAs a Package Design/Development Quality Assurance (DDQA) Senior Manager in Micron’s Global Quality organization, you will lead a specialized engineering team responsible for enabling the successful introduction of Micron’s most advanced package technologies. This role is critical in identifying and mitigating chip-package interaction risks, reliability concerns, and customer integration challenges early in the development cycle.
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Key Responsibilities
- Lead DDQA strategy for new package technology introductions, focusing on CPI and customer integration risks.
- Drive early identification and mitigation of package-level reliability and interaction risks.
- Define and oversee characterization and reliability test strategies.
- Ensure effective root cause analysis and closure of package technology quality issues.
- Drive systematic capture and reuse of lessons learned in next-generation technologies.
- Act as the technical escalation point for package-related customer quality and integration issues.
- Lead, mentor, and develop a highly technical DDQA engineering team.
Requirements
- 10+ years of experience in Packaging Technology, Assembly Engineering, Product Quality and Reliability Engineering, or Failure Analysis.
- Demonstrated ability to lead and develop senior technical engineers.
- Strong knowledge of semiconductor package assembly and surface-mount processes.
- Solid understanding of thermomechanical, thermal, mechanical, and hygroscopic stress effects on package reliability.
- Working knowledge of industry reliability test methods, acceleration models, and sampling statistics.
- Experience applying FMEA and structured problem-solving methodologies (e.g., 8D).
- Strong analytical skills to translate complex data into clear technical decisions.
- Proven ability to collaborate across functions and influence outcomes in complex technical environments.