About the role
AI summarisedJoin our High Bandwidth Memory (HBM) team within the Heterogeneous Integration Group to drive innovation in low-power per bit solutions for Machine Learning (ML) and Artificial Intelligence (AI). This role involves end-to-end design, debugging, and qualification of advanced HBM products, requiring close collaboration across design, manufacturing, and test teams.
IDMOnsiteHIG
Key Responsibilities
- Serve as a key interface between Design, Manufacturing, Test, Quality departments, and external customers.
- Perform validation work on test modes and designs using simulation, data analysis, and ATE/bench analysis.
- Root Cause Analysis (RCA) and resolution of manufacturing, test, and quality issues through hardware/software debugging in the lab, circuit simulations, and data analysis.
- Utilize in-house statistical tools for engineering data analysis to assess product performance and reliability.
- Drive innovation by challenging the status quo and promoting improvements in procedures or products.
- Make technical decisions regarding risk analysis and project prioritization that impact technological development direction.
- Identify system and process improvements to promote continuous cost reduction and quality enhancement.
Requirements
- Bachelor's or Master's degree in Electrical & Electronics Engineering or related field.
- More than 5 years of relevant professional experience.
- Strong knowledge of VLSI, semiconductor process, and basic device physics.
- Exposure to Schematic capture, Simulation, Data Analysis, Lab Debug, or Pattern Manipulation.
- Proficiency in Verilog, VHDL, or System Verilog.
- Excellent problem-solving and analytical capabilities.
- Ability to work effectively in cross-functional, team-based projects.