About the role
AI summarisedAs an Advanced Packaging Characterization Engineer within Advanced Packaging Technology Development (APTD), you will be the domain expert responsible for providing package development characterization and failure analysis support across various product stages, from test vehicles to customer returns. This role requires establishing advanced characterization methodologies and collaborating cross-functionally to drive root cause fixes in cutting-edge packaging technologies.
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Key Responsibilities
- Establish relevant analysis methods to support advanced packaging technology development as the domain expert.
- Conduct electrical verification and failure analysis using PFA techniques to confirm failures and establish best methods for de-processing packages.
- Document failure analysis techniques used to isolate failures and provide quick, responsive feedback to Product, Process Integration, Reliability, Assembly, RMA, and QRA groups.
- Maintain laboratory compliance with safety standards (TS, ISO14001, OHSAS) and manage exhaust/scrubber systems.
- Coordinate equipment calibrations, procure necessary parts, and manage vendor support for repairs.
Requirements
- 4+ years of experience in the semiconductor process, preferably in R&D or technology development/failure analysis.
- Strong expertise in failure analysis methodologies and techniques.
- PhD, Master’s, or Bachelor’s degree in Materials Science, Chemical Engineering, Electrical/Electronics Engineering, or a related discipline.
- Hands-on proficiency with analytical tools including SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X-ray, CSAM, Ion Milling, delayering, and decapsulation techniques.
- Proven ability to collaborate effectively with internal teams (Process Integration, Product Engineering) and external partners.
- Strong mindset emphasizing customer focus, continuous improvement, and striving for excellence.