About the role
AI summarisedThe Principal Engineer in Process Development – Advance Thin film plays a critical leadership role in the strategic advancement and implementation of sophisticated structural and electrical film processes for NAND memory technology. This position defines technical direction, fosters innovation, and ensures the successful integration of new processes into manufacturing to drive next-generation device scaling.
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Key Responsibilities
- Define and implement the technical strategy for structural and electrical film process development, aligning with business and technology objectives.
- Lead multi-functional teams in the development, integration, and scaling of thin film processes for advanced NAND structures.
- Oversee the end-to-end development of process modules, focusing on manufacturability, scalability, and integration readiness.
- Resolve complex technical challenges with significant business implications, including root cause analysis and failure mitigation.
- Mentor senior engineers and influence organizational technical direction to foster excellence.
- Represent the function in technical forums, industry consortia, and strategic collaborations.
- Drive technology transfer and ramp-up activities from R&D to high-volume manufacturing.
- Identify emerging trends, risks, and opportunities in structural and electric film technology for future investment.
Requirements
- Demonstrated mastery of thin film deposition processes, including Atomic Layer Deposition and Chemical Vapor Deposition.
- Expertise in process design, optimization, and integration for high-density NAND applications.
- In-depth knowledge of process-device and mechanical interactions during technology scaling.
- Strong understanding of reliability engineering principles for next-generation memory nodes.
- Proven ability to lead complex technical projects from concept through manufacturing scale-up.