About the role
AI summarisedThe Technical Program Manager for External Manufacturing Operations - Backend Engineering at AMD leads advanced and legacy packaging programs from NPI through production ramp. This role ensures manufacturing readiness, drives APQP discipline, and aligns cross-functional teams across engineering, supply chain, procurement, and reliability. The position requires a blend of technical packaging expertise and program management skills to support strategic initiatives in semiconductor packaging.
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Key Responsibilities
- APQP ownership within EMO-BE organization which shall include advanced technologies (EFB, CoWoS, WLFO) & Flip Chip BGA/LGA/chiplet NPI gate reviews on manufacturing readiness, driving cross‑functional alignment from early NPI phase through production ramp, ensuring process, quality, and performance meet program milestones
- Formulate, organize, coordinate, and drive interconnected programs or key initiatives with cross functional team members in accordance with the mission and goals of the organization
- Drive Key Program deliverables/ schedules/ budget & analyze program risk and opportunities
- Effectively communicate across organizations/ levels for program status update (both working details to the team, and executive summary for Executive communication)
- Collaborate with internal engineering counterparts and extensive engagement with the Package Engineering organization, as well as cross‑functional coordination with teams such as Procurement, Supply Chain, and Reliability
- Drive program deliverables and providing accurate, timely program status updates and executive summaries throughout the program lifecycle
- Developing innovative programs to support the strategic direction of the organization
- Responsibilities may be adjusted or expanded based on business needs, as assigned by the supervisor
Requirements
- Experience in Process Integration or Product Engineering with Program Management experience
- Strong hands‑on experience in both Advanced Packaging (EFB, CoWoS, WLFO) and legacy packaging (Flip Chip BGA, LGA & chiplet packages)
- Proven experience with APQP, NPI phase gates, and manufacturing readiness
- Experience in semiconductor engineering environment with NPI to HVM experience
- Strong technical communication for executive and cross‑site alignment
- Creative, self-driven, highly motivated individual with demonstrated ability to independently manage complex engineering tasks
- Strong interpersonal communication, analytical, project management, task & time management and excellent communication skills
- Experience in managing horizontally across multiple internal functional organizations
- Experience with data analytics, dashboards, or data‑driven reporting is a plus
- Professional fluency in English to support technical documentation, stakeholder communication, and cross‑site engineering collaboration across the region
- Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Chemical Engineering or related engineering discipline