Micron Technology

Senior Engineer, Process Development, Diffusion, NTI

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeOnsitePosted 1 month ago

About the role

AI summarised

Micron’s Singapore Technology Development (TD) team is seeking a passionate and driven Process Development Engineer to support the rapid deployment of advanced NAND technology nodes. This role is critical in enhancing process margins, integrating new technologies into manufacturing, and collaborating globally to shape the future of memory technology.

IDMOnsiteSTPG

Key Responsibilities

  • Develop and optimize unit processes to meet yield and quality targets for advanced NAND devices
  • Evaluate innovative process and equipment solutions for early experimentation and process margin improvement
  • Collaborate with Singapore-based Diffusion manufacturing teams to identify and prioritize key technology challenges
  • Integrate and troubleshoot processes within cross-functional teams focused on yield and quality enhancement
  • Partner with Boise TD Films teams to align future device requirements with process capabilities
  • Identify disruptive process technologies early and define viable implementation paths with global TD and manufacturing teams
  • Conduct fundamental research, hardware evaluations, and novel process testing to support intellectual property generation
  • Design and execute experiments to expand process margins and validate manufacturability of next-node solutions
  • Lead multidisciplinary projects across teams, sites, and suppliers focused on quality, yield, cost, and productivity

Requirements

  • Bachelor/Masters in Materials Science, Electrical/Electronics, Chemical, Microelectronic Engineering, Physics with minimum 5 years of relevant experience
  • PhD in Materials Science, Electrical/Electronics, Chemical, Microelectronic Engineering, Physics is also acceptable
  • Strong understanding of flow dynamics, thermodynamics, and physical phenomena in deposition
  • Knowledge of precursor depletion effects in 3D structures and mitigation strategies
  • Proficiency with interface characterization techniques (e.g., SIMS, XPS, EDX, SEM/TEM)
  • Understanding of integration and structural constraints in film deposition processes
  • Familiarity with memory process flows, especially for planar and vertical NAND
  • Proficiency in data analysis tools (e.g., Y3) and Design of Experiments (DoE)
  • Excellent communication skills for both in-person and remote interactions
  • Self-motivated, adaptable, and capable of managing multiple projects in a dynamic environment