About the role
AI summarisedJoin our High Bandwidth Memory (HBM) Heterogeneous Integration Group to innovate and integrate end-to-end groundbreaking front-end and backend processes. This role focuses on developing lowest power per bit solutions for Machine Learning (ML) and Artificial Intelligence (AI) applications through rigorous design, debugging, and qualification of HBM technology.
IDMOnsiteHIG
Key Responsibilities
- Serve as a key interface between Design, Manufacturing, Test, Quality internal departments and external customers.
- Perform validation work on test modes and design using simulation, data analysis, and ATE/bench analysis.
- Utilize in-house statistical tools for engineering data analysis to provide insights into product performance and reliability.
- Drive innovation by challenging the status quo and promoting improvements in procedures or products.
- Make technical decisions regarding risk analysis and project prioritization that impact technological development direction.
- Identify system and process improvements to promote continuous cost reduction and quality enhancement.
Requirements
- Bachelor's or Master's degree in Electrical & Electronics Engineering or a related field, or equivalent experience.
- More than 5 years of relevant professional experience.
- Strong knowledge of VLSI, semiconductor process, and basic device physics.
- Exposure to Schematic capture, Simulation, Data Analysis, Lab Debug, or Pattern Manipulation.
- Proficiency in Verilog, VHDL, or System Verilog.
- Excellent problem-solving and analytical skills.
- Ability to work effectively in team-based projects toward shared goals.