About the role
AI summarisedAs a PDE Yield Enhancement (YE) Engineer within Package Development Engineering (PDE), you will be responsible for yield monitoring, excursion management, and yield stabilization during High Bandwidth Memory (HBM) New Product Introduction (NPI). This critical role ensures robust yield performance from first silicon through NPI ramp and early HVM by collaborating closely with Process Integration (PI), MRDA, Process Engineering (PE), Assembly/Test Manufacturing, and Quality teams.
IDMOnsiteAssembly & Test
Key Responsibilities
- Account for HBM NPI builds across Post Wafer Finishing (PWF), Assembly, and test through defect breakdown and Physical Failure Analysis (PFA) submission to understand fail mode.
- Work closely with PI to identify defects originating from their area and brainstorm Continuous Improvement Plans (CIP).
- Assist in maintaining yield dashboards and trackers, supporting PI/PE/Real Time Defect Analysis (RDA) in accounting for and breaking down yield loss.
- Analyze and report on yield deviation issues, triggering necessary actions from PI, Process Engineering (PE), or RDA.
- Support block run and partial conversion build yield analysis to detect early impacts on overall yield.
- Brainstorm with cross-departmental staff for improvement opportunities to propose to PI.
- Integrate AI-assisted tools and insights into daily work to enhance efficiency, quality, or effectiveness.
Requirements
- Bachelor's or master's degree in engineering or related discipline.
- 0–2 years of experience in semiconductor manufacturing or engineering.
- Strong interest in yield analysis and data-driven problem solving.
- Basic knowledge of statistics, SPC, or data analysis tools.
- Ability to apply baseline digital fluency and role-appropriate AI literacy to use AI-enabled tools responsibly.
- Strong analytical, logical, and critical thinking skills.
- Effective communicator capable of collaborating across all levels.
- Growth mindset with a passion for continuous learning.