About the role
AI summarisedLead a high-performing team of shift engineers and technicians within Advanced Packaging Technology Development (APTD) to deliver critical package characterization and failure analysis (FA) support for leading-edge technology development. This role owns lab operational excellence, drives technical direction, and partners globally to ensure high-quality results that impact critical APTD decisions.
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Key Responsibilities
- Lead Package Characterization lab operations to meet key performance metrics, cycle-time, and safety standards.
- Plan and optimize FA lab equipment, space, and budget to support current and future needs with high utilization efficiency.
- Coordinate equipment calibration, repairs, and spare parts procurement to ensure sustained equipment uptime.
- Evaluate and introduce new FA tool models and capabilities in partnership with vendors and Micron subject-matter experts.
- Provide technical mentorship and drive continuous improvement of package characterization methodologies and procedures.
- Collaborate cross-site to benchmark and standardize best-known methods to improve lab efficiency and effectiveness.
- Ensure FA lab readiness for new product designs and technologies.
Requirements
- Bachelor’s degree or higher (Master’s/PhD preferred) in Materials Science, Physics, Chemistry, or related field.
- 8+ years of experience in semiconductor package characterization (physical/thermal/chemical) and failure analysis field.
- Knowledge of package FA tools including SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X-ray, CSAM, ion milling, delayering, and decapsulation.
- Knowledge of semiconductor or advanced packaging manufacturing processes.
- Experience in lab management, shift resource planning, and budgeting.
- Proven technical leadership and people management capability.
- Strong written and verbal communication skills with a customer-focused mentality.