About the role
AI summarisedAs part of APTD SG Technology Development Process Integrator, you will be responsible for developing advanced packaging process solutions and ensuring the success of New Process, New Equipment, New Material, and Path finding activities for all advanced package products at Micron. This role drives process readiness and improves yield, quality, and reliability through process characterization and optimization.
IDMOnsiteHIG
Key Responsibilities
- Develop and qualify new packaging process, material, equipment, and technology solutions to meet new Technode requirements and schedules.
- Perform CPI NUDD, process TRA, risk mitigation execution, and process recipe readiness prior to Silicon arrival to ensure first pass rate.
- Identify path finding opportunities for Micron's technology leadership regarding time to market, yield improvement, cost efficiency, and touchpoint optimizations.
- Understand future trends in packaging solutions and collaborate with teams to establish new capabilities to enhance process performance.
- Define, develop, and establish process capabilities, strategy, and roadmap.
Requirements
- PhD/Masters/Bachelor’s Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience.
- 10 years' and/or above experience in the semiconductor industry, preferably in R&D or technology development or failure analysis.
- Strong expertise in failure analysis methodologies and techniques.
- Experience in DRAM/NAND technology.
- Experience in Frontend fab Process integration or Module process.
- Experience in Backend advance packaging wafer/die level process or integration.
- Experience with temporary/permanent bonding technology (Wafer on wafer, Chip on wafer).
- Understanding of silicon integration and its interaction at backend process & package level through CPI.
- Proficiency with simulation tools and data analytics platforms for performance analysis and optimization.