About the role
AI summarisedAs a key leader in the High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high-performing team driving Media Health Manufacturing for Micron’s latest HBM products across DRAM, Interface die, and stacked products. You will lead a portfolio focused on achieving Best-In-Class KPIs including Quality, Cost, Cycle Time, and Scale.
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Key Responsibilities
- Lead manufacturing test flow development and validation for next-generation HBM products.
- Drive DFT (Design For Test) strategy to improve cost, cycle time, and quality.
- Improve device/stacked yield through in-depth circuit debug, test coverage optimization, and strategy innovation.
- Support design verification and in-depth circuit analysis of new products using CAD tools and Verilog simulations.
- Drive innovation to provide a technical advantage over competitors in HBM technology.
- Collaborate cross-functionally with Fab, Product Leads, Design, and Test teams to achieve strategic objectives.
- Mentor and develop team members while managing projects from inception to delivery.
Requirements
- Proven experience in HBM product engineering or a related advanced memory technology.
- Demonstrated ability to optimize test coverage for high-volume manufacturing across various process nodes.
- Strong technical background in circuit debug and reliability analysis for DRAM/Interface/Stacked Die.
- Experience with manufacturing test flow development and validation.
- Proficiency in using CAD tools and Verilog simulations for design support.
- Proven ability to drive yield improvement and cost reduction in high-volume manufacturing environments.
- Ability to make critical technical decisions regarding risk analysis and project prioritization.