About the role
AI summarisedJoin an inclusive team dedicated to relentless innovation in information technology. This role focuses on ensuring the reliability and quality of High Bandwidth Memory (HBM) products through rigorous testing, root cause analysis, and process optimization.
IDMOnsiteHIG
Key Responsibilities
- Define and develop reliability stress, test flows, and test plans covering all Product Reliability aspects.
- Drive down Extrinsic and Intrinsic Reliability (Time 0 and Field DPM) by optimizing Manufacturing Test Flows and Test Strategy to meet critical KPIs (Quality, Cost, Cycle Time).
- Debug and identify root causes of failures in reliability tests using Electric Failure Analysis (EFA) and Physical Failure Analysis (PFA), driving resolutions through cross-functional collaboration.
- Provide recommendations to fab teams for new process conversions to reduce cost and increase yields, impacting HBM product quality and reliability.
- Manage risks associated with DPM process conversions by communicating closely with Product Managers/Leads to balance innovation pace with stability.
- Promote technical innovations that provide Micron with a competitive advantage in the market.
Requirements
- Bachelor’s or Master’s degree in Electrical and Electronics Engineering or a related field.
- Solid understanding of problem-solving methodologies, focusing on root cause identification and solution exploration.
- Familiarity with CMOS technology, DRAM architecture, and basic device physics.
- Exposure to data analysis, statistics, and scripting tools such as Python or JMP.
- Strong attention to detail and a commitment to quality assurance.
- Ability to work effectively in team-based projects toward shared goals.