Qualcomm

Engineer, Senior (Process Development - Chemical-Mechanical Planarization, CMP)

Qualcomm
Fabless SemiconductorSingapore, Central Singapore, SingaporeOnsitePosted 1 week ago

About the role

AI summarised

The Senior Engineer in Process Development for Chemical-Mechanical Planarization (CMP) leads the development, qualification, and high-volume manufacturing transfer of new CMP processes and materials. This role involves driving process innovation, ensuring manufacturability and yield targets through data-driven methods, and coordinating cross-functionally with technology partners and equipment teams. The position requires strong expertise in DOE, SPC, FMEA, and semiconductor manufacturing, with experience in scaling processes from R&D to pilot and high-volume production.

FablessOnsiteHardware Engineering

Key Responsibilities

  • Define process requirements, success criteria, design-of-experiments (DOE), and characterization plans
  • Drive root-cause analyses, failure mechanism studies, and improvement loops to achieve performance, yield, and reliability targets
  • Translate product requirements into process specifications and control strategies
  • Work with project leader on technology transfer from pilot line to high-volume manufacturing
  • Lead and drive technical discussions for onsite process transfer activities, including documentation (PFMEA, etc), training, process replication, and equipment matching
  • Work with equipment team on equipment set up and process cluster on establishing critical process windows, statistical control limits, and ramp-readiness criteria
  • Coordinate and report ramp performance tracking (yield, scrap, cycle time, tool capability) and drive closure of gaps
  • Initiate and participate actively in discussions on formulation of process technology innovation and release process improvement
  • Collaborate and develop effective working relationships with technology partners to accomplish project/task goals within committed schedule
  • Develop new and impactful ideas, materials, solutions, and/or procedures for product fabrication process and technology meeting business goals and launch schedule with competitive manufacturing costs

Requirements

  • Bachelor’s or Master’s degree in Engineering (Material Science, Mechanical Engineering, Chemical Engineering, or related fields)
  • 3+ years of experience in Chemical Mechanical Planarization (Polishing) process engineering, process development, or as process engineer in a high-volume manufacturing fab
  • Strong skills in DOE, SPC, data analytics, FMEA, and troubleshooting
  • Excellent communication, technical documentation, and stakeholder management skills
  • Resourceful with critical thinking in problem solving
  • Project and priority management skills
  • Experience in semiconductor, MEMS, packaging, or high-volume manufacturing
  • Familiarity with yield engineering, reliability mechanisms, and failure analysis as well as use of statistical tools, DOE, PFCP/PFMEA, etc.
  • Experience with scale-up from R&D → Pilot → HVM
  • Knowledge of Lean, Six Sigma, or structured problem-solving (8D, DMAIC)
  • Able to multi-task, set priorities and meet critical deadlines
  • Maintain open communication
  • Able to attend training program overseas at sister’s fab for up to 1 year