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Micron Technology

STAFF ENGINEER FE GLOBAL WAFER LOGISTIC AUTOMATION

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeOnsitePosted 1 month ago
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About the role

AI summarised

Join Micron as a Staff Engineer in the Global Wafer Logistic Automation team, driving world-class innovation by providing technical ownership and engineering support for mechanized packaging solutions to ensure the flawless delivery of wafer logistics.

IDMOnsiteFront End

Key Responsibilities

  • Provide technical ownership and engineering support for mechanized packaging solutions, including FOSB and HWS/BHWS Auto Packer, Auto Unpacker, and Auto Packer and Unpacker for Hybox applications.
  • Support and advance HWS (Horizontal Wafer Shipper) packing operations, covering process definition, validation, and sustained improvement.
  • Promote worldwide consistency in equipment specifications, process flows, and operating procedures for semiconductor packaging and shipping.
  • Partner with equipment suppliers to define requirements, review builds, support FAC/SAC, and resolve technical and operational issues.
  • Assist new fab wafer logistic automation rollouts by conducting layout reviews, evaluating capacity, and coordinating deployment efforts.
  • Analyze equipment and process performance data to identify improvement opportunities in efficiency, reliability, ergonomics, and safety.
  • Collaborate with AMHS, warehouse operations, EHS, quality, and IT teams to ensure compliance with Micron policies and standards.
  • Develop and maintain engineering documentation, specifications, and standard process guidelines.
  • Provide technical mentorship and training to site engineers and operations teams.
  • Support technology roadmaps and future automation initiatives related to wafer packaging and logistics.

Requirements

  • Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Mechatronics, Automation Engineering, or a related field.
  • 7+ years of engineering experience in semiconductor manufacturing, warehouse automation, or wafer logistics.
  • Hands-on experience with FOSB and HWS Auto Packer / Auto Unpacker / Hybox Auto Packer/Unpacker systems.
  • Demonstrated expertise in automated packaging systems and semiconductor logistics.
  • Solid technical knowledge in equipment specification, process flow, and operating procedures.
  • Working knowledge of HWS (Horizontal Wafer Shipper) packing processes.
  • Outstanding analytical skills to determine and successfully implement process improvements.
  • Ability to collaborate effectively across global, cross-functional teams.
  • Excellent written and verbal communication skills, with the ability to deliver clear technical guidance and mentorship.