About the role
AI summarisedJoin the revolutionary Next Generation NAND research & development Dry Etch team to drive critical modules in advanced NAND technology. This role offers significant opportunities for innovation, collaboration, and scaling cutting-edge processes.
IDMOnsiteSTPG
Key Responsibilities
- Lead Dry Etch unit process and critical module development for Next Generation NAND.
- Develop and innovate dry etch processes to meet stringent structural and electrical specifications.
- Collaborate with cross-functional teams (Wet Etch, CVD, Diffusion, Metals, Lithography & CMP) to solve complex structural problems.
- Present process and technology roadmaps for current and future technology nodes.
- Serve as a resource and mentor to peers in dry etch technology and project management.
- Drive collaborative solutions across process areas and guide technology roadmaps.
Requirements
- Demonstrated aptitude for a research and development environment.
- Knowledge of plasma physics, plasma chemistry, transport, or surface phenomena.
- Demonstrated leadership in problem-solving and technical project management.
- Understanding of various types of plasma dry etch reactors (e.g., RF sources, chemistries).
- Expertise in statistical process control and analysis.
- Experience solving scalability problems of deep high aspect ratio silicon/dielectric etches with advanced pulsing schemes.
- Ability to lead supplier negotiations.