Micron Technology

Principal/Staff Engineer, PCVD Film Deposition, TD

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeOnsitePosted 4 months ago

About the role

AI summarised

Join our Technology Development team to drive innovation in advanced thin film deposition processes for next-generation memory technologies. This leadership role spans from hands-on process development to defining future technology roadmaps.

IDMOnsiteSTPG

Key Responsibilities

  • Develop and optimize advanced thin film deposition processes (ALD, LPCVD, PECVD, PVD) for cutting-edge device architectures.
  • Design and execute complex DOE experiments to improve process capability, uniformity, and reliability.
  • Perform in-depth root-cause analysis using advanced modeling and characterization techniques.
  • Collaborate with integration, other process areas, metrology, and equipment engineering teams to solve critical technical challenges.
  • Drive innovation in film deposition for improved performance, cost efficiency, and sustainability.
  • Utilize advanced data analytics and modeling to predict process behavior and accelerate development cycles.
  • Define technology roadmaps and lead strategic research initiatives to generate intellectual property.

Requirements

  • Ph.D or Master’s degree in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or a related field.
  • Minimum 8 years of experience with a Master’s degree, or minimum 5 years of hands-on experience with a Ph.D.
  • Expertise in ALD, LPCVD, PECVD, and PVD for advanced nodes.
  • Strong understanding of film growth mechanisms, surface chemistry, and plasma physics.