About the role
AI summarisedAs a Yield Failure Analysis Engineer in Micron NAND Technology Integration (NTI) Singapore, you will be responsible for providing yield analysis for next-generation Micron products. This role requires becoming a domain expert in physical failure analysis methods to identify and communicate yield issues, assist with root cause analysis for process deviations, and characterize fabrication data to pinpoint failure sources.
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Key Responsibilities
- Drive failure analysis initiatives to enhance yield, creating and delivering new methodologies for de-processing failures.
- Participate in global meetings and present technical results to Product Development and Process Integrations teams.
- Collaborate with metrology and RDA teams to redefine and validate inline detection capabilities.
- Assist in the transfer documentation of layout/architecture fundamentals from R&D to manufacturing fab.
Requirements
- Bachelor of Science or Master Degree in Electrical Engineering, Microelectronics, Material Science, or Chemical Engineering.
- 4 - 10 years of experience in Failure Analysis or PFA.
- Proven ability to conduct electrical characterization and perform electrical verification of failures.
- Strong understanding of PFA techniques available for de-processing failures.
- Ability to understand and follow all health, safety, and environmental procedures and requirements.