About the role
AI summarisedJoin the HIG HBM Package Product Engineering team to lead and develop high-performing activities driving Package and HBM Product engineering. You will be part of a global team focused on critical KPIs: Quality, Cost, Cycle Time, and Scale, collaborating across functions to meet strategic objectives.
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Key Responsibilities
- Improve assembly-related coverage within manufacturing flows to enhance Time 0 and Field DPM and prevent inline fallout.
- Improve HBM Cube yield through test optimization and coverage by collaborating with Technology Development and Packaging organizations.
- Debug and identify root causes of failures in Electrical Failure Analysis (EFA) and Physical Failure Analysis (PFA) for Quality and RMA packaging issues, driving resolutions through cross-functional collaboration.
- Establish robust Process Conversion Business Processes with FAB, Technology Development, and Advanced Packaging TD to facilitate Yield Improvement and DPM improvement for HBM Products.
- Provide recommendations on new process conversions to reduce cost and increase yields, directly impacting product quality and reliability.
- Mentor and develop team members to foster growth within the organization.
- Collaborate with cross-functional teams (Fab, HBM Technology Development, HBM Design, System Development, Quality/Reliability) for holistic product development.
- Promote innovation and drive changes that provide a technical advantage over competitors.
- Lead project management efforts for efficient execution and timely delivery of technological solutions.
- Make final technical decisions regarding risk analysis and project prioritization.
- Collaborate on developing, deploying, and validating AI/ML models to enhance KPIs like Quality, Cost, Cycle Time, and Scale.
Requirements
- Bachelor's/Master's degree in Electrical, Electronic, Mechanical Engineering, or a related field.
- At least 5 years of hands-on experience in the semiconductor industry.