About the role
AI summarisedJoin Micron, a global leader in memory and storage solutions, to drive innovation in advanced packaging integration. This role focuses on developing and enabling cutting-edge package technology while achieving high yields, reducing costs, and ensuring seamless product transitions from development to high-volume manufacturing.
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Key Responsibilities
- Develop and enable advanced package technology for various post-fab wafer finish and assembly processes.
- Drive product quality improvements, yield enhancements, cost reductions, and productivity gains through semiconductor integration.
- Achieve and improve yields through silicon package integration innovation, going beyond layout/design or process margin improvements.
- Collect and analyze complex data to provide actionable outcomes for layout, design, or integration flow changes.
- Collaborate with Probe, Yield Analysis, Test, and Product Engineering teams to drive continuous process improvements.
- Ensure defense coverage through rigorous process, measurement, inspection, and testing protocols.
- Establish correlations between defense mechanisms to identify critical improvement opportunities.
- Work cross-functionally with multiple engineering groups (PWF, Assembly, Front End Wafer Fab, Product Engineering) to integrate manufacturing processes.
- Provide Process Of Record (POR) and Model Of Record (MOR) documentation for high-volume manufacturing transfer.
Requirements
- Bachelor’s or advanced degree in Engineering or Science.
- Strong analytical, logical, and critical thinking abilities.
- Effective communicator capable of collaborating across all organizational levels.
- Growth mindset with a proven passion for continuous learning.
- Interest in and knowledge of the semiconductor industry is preferred.
- Demonstrated leadership and a track record of impact are highly desirable.