About the role
AI summarisedJoin the Advanced Packaging Technology Development (APTD) team at Micron to drive innovation in high-performance memory products. This role focuses on developing and enabling deployment of assembly processes for advanced packaging technologies, crucial for meeting the demands of AI and high-bandwidth memory (HBM).
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Key Responsibilities
- Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking (Chip on Wafer, Chip to Wafer).
- Improve product quality, drive yield enhancements, reduce costs, and enhance productivity through process development.
- Evaluate and promote new equipment and materials to enhance overall process capabilities.
- Set up and manage process parameters for various semiconductor equipment.
- Ensure defense coverage through rigorous process, measurement, inspection, and testing protocols.
- Collaborate with internal and external partners to execute technology development strategies aligned with business objectives.
- Coordinate closely with various teams (Package Integration, Assembly Engineering, Front End Wafer Fab, etc.) to integrate manufacturing processes for optimal performance.
- Provide Process Of Record (POR) and Model Of Record (MOR) documentation for successful product transfer to High Volume Manufacturing.
Requirements
- Proven ability to develop and enable deployment of assembly processes for advanced packaging technologies.
- Experience meeting stringent requirements in performance, cost, manufacturability, quality, reliability, and schedule.
- Strong background in process development within semiconductor manufacturing environments.
- Ability to conduct continuous data analysis to establish advanced controls and identify improvement opportunities.
- Experience working across organizational boundaries with diverse engineering teams.
- Commitment to ensuring a smooth transition from new product development through high volume production.