About the role
AI summarisedJoin a groundbreaking Next Generation NAND research and development Dry Etch team as an MTS/Principal Engineer. This role involves leading innovation in Dry Etch technology, developing processes to meet stringent structural and electrical specifications, and collaborating cross-functionally with teams like Wet Etch, CVD, Diffusion, Lithography, and CMP to achieve program and yield targets for advanced NAND products.
IDMOnsiteSTPG
Key Responsibilities
- Lead innovation in Dry Etch technology and drive essential module advancement for Next Generation NAND.
- Develop and innovate dry etch processes to meet demanding structural and electrical specifications.
- Collaborate with hardware teams to define the equipment roadmap for current and upcoming generation NAND products.
- Lead cross-functional teams to troubleshoot and solve complex structural problems encountered during development.
- Present detailed process and technology roadmaps for current and future technology nodes to stakeholders.
- Proactively identify potential future process issues and develop robust mitigation plans.
- Mentor less experienced engineers and contribute to the Technical Leadership Program.
Requirements
- 6-10 years’ experience in dry etch process development within an R&D environment transitioning into manufacturing.
- 4-5 years of applicable experience in NAND, DRAM, or Logic module development involving cross-functional team projects.
- Strong knowledge of plasma physics, plasma chemistry, transport, or surface phenomena.
- Demonstrated leadership in technical problem-solving and experience managing complex technical projects.
- In-depth understanding of various plasma dry etch reactor types (e.g., RF sources, chemistries).
- Expertise in statistical process control and advanced data analysis.
- Proven experience solving scalability issues in deep high aspect ratio silicon/dielectric etches using advanced pulsing schemes.