About the role
AI summarisedAs a key leader within the High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high-performing team focused on intrinsic and extrinsic reliability test development and execution for Micron’s latest HBM products across DRAM, Interface die, and stacked products. Your primary goal is to drive extrinsic DPM reduction (Time 0 and Field DPM) while leading the intrinsic reliability charter to meet critical KPIs in Quality, Cost, and Cycle Time.
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Key Responsibilities
- Define and develop reliability stress, test flows, and test plans covering all Product Reliability aspects.
- Drive down Extrinsic Reliability (Time 0 and Field DPM) and Intrinsic Reliability through optimized Manufacturing Test Flows and Test Strategy to meet critical KPIs.
- Debug and identify root causes of failures in reliability tests using Electric Failure Analysis (EFA) and Physical Failure Analysis (PFA), driving resolutions through cross-functional collaboration.
- Provide recommendations to fab teams regarding new process conversions to reduce cost and increase yields, impacting product quality and reliability.
- Manage risks associated with DPM process conversions in collaboration with Product Managers/Leads to balance innovation pace with stability.
- Promote innovation and drive changes that provide a technical advantage over competitors.
Requirements
- Proven experience in reliability testing and failure analysis (EFA/PFA).
- Ability to drive DPM reduction targets in high-performance memory products (HBM preferred).
- Strong understanding of manufacturing test flows and their impact on product quality.
- Experience in cross-functional collaboration with Fab, TD, and GQ teams is essential.
- Clear and effective technical communication skills are required to articulate complex findings.
- Ability to manage projects from conception through execution and resolution.