Dyson

Head of Global Manufacturing Test & PCBA Engineering

Dyson
Consumer ElectronicsSingapore - Technology CentreFull-time1 months ago

About the role

AI summarised

Head of Global Manufacturing Test & PCBA Engineering responsible for leading a world-class global team across manufacturing test, PCBA test, and PCBA process engineering. This role defines test strategy and architecture, drives AI-driven innovation in testing, leads PCBA process excellence, collaborates with R&D and Quality, and ensures operational excellence across global sites and EMS/CM partners. The ideal candidate has 12-15+ years in electronics manufacturing with deep PCBA test and process expertise and a proven track record in deploying AI/ML in manufacturing.

Consumer ElectronicsFull-timeManufacturing Test Engineering

Key Responsibilities

  • Build and develop a world class global team across: Manufacturing Test Engineering, PCBA Test Engineering, PCBA Process Engineering. Define the global structure, talent roadmap, and capability development strategy. Create a culture of engineering rigor, innovation, collaboration, and accountability.
  • Define the global test and PCBA engineering architecture that scales across all product families. Drive innovation through AI based testing, including: AI enhanced AOI/SPI image analysis, ML driven yield prediction and anomaly detection, Adaptive test sequencing to reduce CT, Predictive fault detection and root-cause clustering, Automated limit learning and optimization. Own the roadmap for automation, inline test, data platforms, and global test infrastructure.
  • Lead global excellence in PCBA processes (SMT, reflow, wave/selective solder, rework, conformal coat, potting) to drive cost and productivity. Define global standards, PFMEA, process windows, SPC, and control plans. Standardize equipment selection, process qualification criteria, and data governance.
  • Partner with R&D to embed DFT, DFS, and DFM early in product architecture. Influence schematic design, probe access, boundary scan integration, calibration hooks, and diagnostics.
  • Work closely with Quality organizations to: Reduce escapes and strengthen global containment, Align quality gates, inspection standards, and reliability strategies, Optimize defect pareto visibility, traceability, and root-cause elimination.
  • Lead test and process readiness for all engineering and factory builds (EVT → DVT → PVT → MP). Approve test plans, correlation results, coverage analyses, and CM readiness. Govern golden units, test fixtures, code control, and process qualification.
  • Deliver results across: Yield and FPY, CT/UPH and OEE, Escape rates, quality performance, Test coverage and diagnostic accuracy, Cost of test and process optimization. Implement Lean/Six Sigma, SPC, and continuous improvement globally.
  • Provide strong leadership and technical governance across EMS/CM partners. Establish global expectations for capability, tooling, test SW, fixtures, and documentation. Conduct regular capability audits, QBRs, and joint improvement projects.

Requirements

  • 12–15+ years in electronics manufacturing with deep expertise in PCBA test and process engineering.
  • Strong track record leading multi site/global engineering teams.
  • Proven experience deploying AI/ML in manufacturing test or analytics.
  • Demonstrated success influencing R&D, Quality, and Supply Chain in fast paced environments.
  • Strong technical foundation in ICT, FCT, boundary scan, SMT, AOI/SPI/AXI, and PCBA processes.