About the role
AI summarisedResponsible for the development, qualification, and high-volume production transfer of new processes, materials, and manufacturing technologies within the Interconnect Plating domain. This role requires strong cross-functional coordination to ensure process readiness, manufacturability, and a smooth ramp-up from concept through high-volume manufacturing.
FablessOnsiteHardware Engineering
Key Responsibilities
- Define process requirements, success criteria, Design-of-Experiments (DOE), and characterization plans.
- Drive root-cause analyses, failure mechanism studies, and improvement loops to achieve performance, yield, and reliability targets.
- Translate product requirements into detailed process specifications and control strategies.
- Manage technology transfer from pilot line to high-volume manufacturing, leading technical discussions for onsite process transfers.
- Establish critical process windows, statistical control limits, and ramp-readiness criteria with equipment teams.
- Coordinate and report on ramp performance tracking, including yield, scrap, cycle time, and tool capability, driving gap closure.
Requirements
- Bachelor’s or Master’s degree in Engineering (Materials Science, Chemical Engineering, Chemistry, or related fields).
- 4+ years of experience in Interconnect Plating process engineering, process development, or as a process engineer in a high-volume wafer level package manufacturing fab.
- Strong proficiency in DOE, SPC, data analytics, and FMEA.
- Proven ability to troubleshoot complex manufacturing issues in a high-volume environment.
- Excellent technical documentation and stakeholder management skills.
- Experience scaling processes from R&D through Pilot to High-Volume Manufacturing (HVM).