Marvell

Senior Staff Silicon Photonics Packaging Engineer

Marvell
Fabless SemiconductorSingaporeOnsitePosted 1 month ago

About the role

AI summarised

The Senior Staff Silicon Photonics Packaging Engineer will lead the co-design and packaging development of photonic and electronic integrated circuits, focusing on 2.5D/3D hybrid integration, package qualification, and collaboration with cross-functional teams including design, signal/power integrity, and OSAT partners. The role requires expertise in advanced packaging design, simulation tools, and high-speed testing, with a preference for direct experience in silicon photonics packaging.

FablessOnsite

Key Responsibilities

  • Develop photonics IC (PIC) and electronics IC (EIC) co-design flow
  • Define PIC and EIC IO pad frame and 2.5D interposer floor plan
  • Lead PIC and EIC interconnect schematic and layout design process
  • Define PIC and EIC hybrid integration packaging design rules, process flow, and material sets
  • Lead optical package development to establish package manufacturability and reliability
  • Collaborate with cross-functional teams consisting of Digital and Analog Circuit designers, Signal/Power Integrity, and substrate layout, and system design team

Requirements

  • Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 5+ years of related professional experience
  • Master’s degree and/or PhD in Computer Science, Electrical Engineering or related fields with 3+ years of experience
  • Expertise in designing hybrid multi-chip integration using 2.5D/3D packaging
  • Direct experience in Si Photonics based packaging design is a plus
  • Experience in layout design tools for ICs and/or packaging, and 2.5D/3D EM simulation tools such as HFSS, SI-Wave, Momentum, IE3D, CST, PowerSI
  • Device or package characterization and testing as required in the development environment
  • High speed testing background is preferred
  • A strong understanding of wafer level packaging process flow
  • Direct experience in collaborating with major OSAT for developing advanced packaging technology for high-speed optics and/or electronics IC is a plus
  • Ability to work with a large body of data and the necessary statistical analysis tools
  • Ability to present the data and ideas to a diverse audience
  • Effective communication and presentation
  • Team player. Expected to work with cross-functional team