About the role
AI summarisedThis senior-level Substrate Engineer role at Broadcom focuses on managing IC substrate subcontractors to ensure the quality, yield, and delivery of high-volume semiconductor devices. The engineer will lead NPI activities, drive process improvements, and standardize technical best practices across Asian manufacturing sites.
FablessOnsite
Key Responsibilities
- Responsible for working with Broadcom's IC substrate subcontractors to manage and resolve issues relating to packaging, manufacturing, yield, quality, and delivery of high volume semiconductor devices.
- Responsible for NPI activity, risk assessments, process improvement & development and production engineering support of high volume IC substrate manufacturing.
- Work with Broadcom internal cross functional engineering teams resolve issues with interactive nature; work on newly developed packaging technology and drive towards high volume manufacturing maturity
- Responsible for new product pre-production engineering activity and drive improvements in process and visual mechanical yields, cycle time.
- Take on site to site standardizations in Best Known Methods, and verification on compliance towards Broadcom requirements
- Drive capability enhancement and cost reduction projects
Requirements
- Bachelor Degree in an engineering discipline (Mechanical, Manufacturing, Material Science, Chemical or Electrical).
- 8 years' experience in IC substrate manufacturing technologies and processes.
- Direct process and operational experience in a substrate manufacturing operations line is required.
- Expertise in ABF substrate interactions with Ball Grid Arrays, flipchip; laminate substrates interactions with die attach, wirebonding, molding, flipchip attach, singulation, packaging materials is required.
- Track record of good achievements managing substrate technical specifications that impact the downstream margins of assembly processing.
- Proven ability to manage and coordinate complex activities across multiple groups including operations, quality, business units, suppliers, marketing, customers.
- Experience with managing activities with packaging subcontractors and driving resolution of manufacturing issues.
- Demonstrate leadership in working within different internal functional groups to manage issue containment and drive the best path forward.
- Thorough knowledge of problem solving methodologies and failure analysis techniques.
- Must demonstrate the ability to quickly make assessments of risks and take the necessary steps in managing escalations.
- Have a very good command on spoken and written English, Fluent in Mandarin
- Willing to travel throughout Asia to support manufacturing locations.