About the role
AI summarisedThe role develops and qualifies advanced silicon package solutions, leading cross‑functional teams from concept through high‑volume production while driving material and process innovation.
FablessOnsite
Key Responsibilities
- Work with business unit marketing and IC design teams to select optimum package solutions on cost, performance, manufacturability, and reliability for advanced silicon node products
- Design custom packages with IC design, system design, package SI/PI and thermal engineering teams
- Ensure packages meet CPI, SI/PI, and high‑power thermal requirements (1000sW+) for cutting‑edge silicon products
- Research, develop, and productize new materials such as TIM, build‑up‑film, and underfill for advanced node silicon
- Define assembly BOM, process, troubleshoot and support packaging issues on new advanced technology
- Implement, fine‑tune, and productize newly developed technologies into high‑volume manufacturing
- Create package design documentation and assembly instructions
Requirements
- BS/MS/PhD in STEM, Material Science, Electrical or Mechanical Engineering
- 8+ years experience with BS, 6+ years with MS, or 3+ years with PhD
- Deep understanding of signal integrity and power integrity concepts, including characteristic impedance and s‑parameters
- Expertise with Cadence APD for custom substrate design
- Hands‑on experience with advanced assembly processes for flip‑chip, MCM, and 2.5D packages at 5nm, 3nm/2nm nodes
- Knowledge of chip packaging interaction, wafer BEOL, and advanced substrate manufacturing (e.g., SAP/mSAP, PSPI with Cu RDL)
- In‑depth knowledge of failure analysis techniques for advanced node silicon products
- Proficiency in GD&T and ability to read mechanical drawings
- Strong project management, communication, and leadership skills