About the role
AI summarisedSenior R&D scientist role focused on developing and optimizing wafer-to-wafer bonding processes for advanced semiconductor packaging including 2.5D and 3D IC applications. The position involves leading process innovation, materials research, parameter optimization, reliability testing, and mentoring while contributing to IP and technology roadmaps.
ResearchOnsiteInstitute of Microelectronics
Key Responsibilities
- Leading the design and development of innovative W2W bonding techniques for applications in high-performance computing, AI, and memory
- Optimizing critical bonding parameters such as temperature, pressure, and surface preparation methods (e.g., CMP, plasma activation, cleaning) to achieve high bonding strength, yield, and alignment accuracy
- Addressing challenges related to process integration, such as wafer warpage, thermal budget constraints, contamination, and the reduction of thermo-mechanical stress
- Coordinating and executing comprehensive evaluations of new processes, materials, and equipment
- Conducting electrical, thermal, and mechanical reliability characterization of bonded structures (e.g., using SEM, SAM, AFM) to validate performance and ensure manufacturing guidelines are met
- Utilizing metrology tools and data analysis to assess surface topography, void defects, and bond quality, and driving quality improvements based on these findings
- Conceiving, planning, and leading high-impact projects, often involving external partners and stakeholders
- Collaborating with senior staff and process integrators to define and address future technology roadmaps and business challenges in advanced packaging
- Inspiring and mentoring scientists, engineers and technicians in advanced semiconductor technologies
Requirements
- PhD degree in Materials Science, Mechanical Engineering, Physics, Chemistry, Electronics, or Electrical Engineering
- Experience in W2W bonding process, with a strong track record in advanced packaging technologies is added advantage