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AMD

Technical Program Manager - External Manufacturing Operations, Backend Engineering

AMD
Fabless SemiconductorSingapore, SingaporeOnsitePosted 4 weeks ago
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About the role

AI summarised

Drive and lead complex programs within External Manufacturing Operations - Backend Engineering (EMO-BE) focusing on advanced packaging technologies (EFB, CoWoS, WLFO) and legacy solutions. This role ensures robust manufacturing readiness, maintains APQP discipline, and drives cross-functional alignment from early NPI through production ramp.

FablessOnsiteEngineering

Key Responsibilities

  • Own APQP within EMO-BE organization for advanced technologies (EFB, CoWoS, WLFO) and legacy packages (Flip Chip BGA/LGA/chiplet), driving NPI gate reviews on manufacturing readiness.
  • Drive cross-functional alignment across all stages from early NPI through production ramp, ensuring process, quality, and performance milestones are met.
  • Formulate, organize, coordinate, and drive interconnected programs and key initiatives with cross-functional team members.
  • Manage Key Program deliverables, schedules, and budget while proactively analyzing program risks and opportunities.
  • Effectively communicate program status updates across all organizational levels, from detailed working discussions to executive summaries.
  • Collaborate extensively with Package Engineering and coordinate cross-functionally with Procurement, Supply Chain, and Reliability teams.
  • Drive program deliverables by providing accurate and timely status updates throughout the entire program lifecycle.

Requirements

  • Bachelor’s or Master’s degree in Mechanical, Materials Science, Chemical Engineering, or related engineering discipline.
  • Demonstrated experience with advanced packaging (EFB, CoWoS, WLFO) and legacy solutions (Flip Chip BGA/LGA/chiplet packages).
  • Proven experience with APQP, NPI phase gates, and manufacturing readiness.
  • Experience in a semiconductor engineering environment with NPI to HVM exposure.
  • Strong technical program management background combined with hands-on knowledge of bumping, packaging, and substrate functions.
  • Excellent cross-functional project management and interpersonal communication skills.
  • Ability to manage complex engineering tasks independently in a fast-paced environment.