Micron Technology

Principal Engineer/MTS, Process Development, Photolithography, NAND

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeFull-time1 weeks ago

About the role

AI summarised

Principal/MTS Photolithography Process Development Engineer at Micron Technology, a semiconductor memory company. Leads advanced photolithography process development for next-generation NAND memory devices, driving innovation and technology transfer across global manufacturing sites.

IDMFull-timeSTPG

Key Responsibilities

  • Lead development and optimization of photolithography processes to achieve yield, quality, and performance targets for advanced technology nodes.
  • Define and translate future device requirements into robust process specifications and equipment roadmaps.
  • Drive early adoption of innovative process and equipment solutions to enhance margin and manufacturability.
  • Identify and integrate disruptive technologies into production flows.
  • Collaborate with global R&D teams and manufacturing sites to ensure seamless technology transfer.
  • Partner with suppliers to accelerate breakthrough solutions and maintain strategic vendor relationships.
  • Implement advanced process control methodologies using statistical tools, DOE, and simulation software.
  • Conduct material evaluations, reticle/layout/OPC development, process window analysis, and overlay optimization.
  • Generate intellectual property through patents and publications; provide technical mentorship and influence technology strategy.

Requirements

  • M.S. or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemical Engineering, or related field.
  • 10+ years in semiconductor photolithography or related process engineering (exceptional candidates with 7+ years considered).
  • Deep expertise in optics, immersion lithography, polarized illumination, and low k1 imaging.
  • Proven track record in defining and executing photolithography process and equipment roadmaps.
  • Proficiency in lithography simulation tools, material characterization, and statistical analysis.
  • Strong understanding of semiconductor process flows and memory architecture.
  • Excellent problem-solving, leadership, and communication skills.
  • Experience with advanced lithography materials (365nm, 248nm, 193nm) and EUV processes.
  • Hands-on experience with cutting-edge photolithography equipment and metrology tools.
  • Demonstrated ability to lead cross-functional projects and influence technology direction.