About the role
AI summarisedSenior research engineer role focused on developing and optimizing PECVD processes for advanced packaging and photonics applications within an R&D environment. The position involves hands-on process development, characterization, troubleshooting, and collaboration with integration and fab teams.
ResearchOnsiteInstitute of Microelectronics
Key Responsibilities
- Develop and optimize Plasma-Enhanced Chemical Vapor Deposition (PECVD) process for Advanced Packaging and Photonics applications
- Characterize thin film properties and troubleshoot process-related issues to ensure quality and performance
- Serve as a subject matter expert, supporting integration teams with technical insights and recommendations
- Collaborate with fab teams to implement and maintain statistical process control (SPC) for thin film modules
- Prepare and deliver technical reports and presentations for both internal stakeholders and external customers
Requirements
- Bachelors/Masters in Materials Science, Electrical Engineering, Chemical Engineering, Physics, Chemistry, and Microelectronics, or related fields
- 3+ years direct experience in semiconductor thin film module, preferably in PECVD module
- Good understanding of thin film deposition techniques and thin film property characterization is desired
- Hands-on experience in Design of Experiments (DOE) methodologies, statistical root cause analysis, and problem-solving methods is desired
- Understanding of thin film tool hardware is advantageous
- Hands-on experience with basic process characterization techniques such as DRSEM, HRTEM and Ellipsometry is advantageous
- Possess good interpersonal and oral/written communication skills, with ability to deliver clear and concise messages to both internal and external stakeholders