About the role
AI summarisedSenior Process Development Engineer responsible for interconnect plating process development, qualification, and transfer to high-volume manufacturing in a semiconductor fab. Leads technology development, root-cause analysis, and ramp performance tracking while collaborating with global teams and technology partners.
FablessFull-timeHardware Engineering
Key Responsibilities
- Responsible for development, qualification, and high-volume production transfer of new processes, materials, and manufacturing technologies.
- Ensure process readiness, robust manufacturability, and smooth ramp‑up through strong cross‑functional coordination, data‑driven decision‑making, and process leadership.
- Initiate and participate actively in discussions on formulation of process technology innovation and release process improvement.
- Collaborate and develop effective working relationships with technology partners to accomplish project/ task goals within committed schedule.
- Develop new and impactful ideas, materials, solutions, and/ or procedures for product fabrication process and technology meeting the business goals and launch schedule with competitive manufacturing costs.
- Serve as technology subject matter expert applying technical knowledge and skills in own area of expertise to address moderately complex issues in manufacturing environment.
- Lead and/ or co-work with global process cluster on new process recipes from concept to qualification and manufacturing release.
- Define process requirements, success criteria, design‑of‑experiments (DOE), and characterization plans.
- Drive root‑cause analyses, failure mechanism studies, and improvement loops to achieve performance, yield, and reliability targets.
- Translate product requirements into process specifications and control strategies.
- Work with project leader on technology transfer - from pilot line to high‑volume manufacturing. Adapts to shifting priorities while ensuring deadlines are met.
- Lead and drive technical discussions to onsite process transfer activities, including documentation (PFMEA, etc), training, process replication, and equipment matching.
Requirements
- Bachelor's or Master's degree in Engineering (Materials Science, Chemical Engineering, Chemistry or related fields).
- 4+ years of experience in Interconnect Plating process engineering, process development, or as process engineer in a high-volume wafer level package manufacturing fab.
- Strong skills in DOE, SPC, data analytics, FMEA, and troubleshooting.
- Excellent communication, technical documentation, and stakeholder management skills.
- Resourceful with critical thinking in problem solving.
- Project and priority management skills.
- Experience in semiconductor, MEMS, packaging, or high‑volume manufacturing.
- Familiarity with yield engineering, reliability mechanisms, and failure analysis as well as use of statistical tools, DOE, PFCP/ PFMEA, etc.
- Experience with scale-up from R&D → Pilot → HVM.
- Knowledge of Lean, Six Sigma, or structured problem-solving (8D, DMAIC).
- Able to multi-task, set priorities and meet critical deadlines. Maintain open communication.
- Able attend training program overseas at sister's fab for up to 1 year.