About the role
AI summarisedResearch Engineer focused on developing and optimizing temporary bonding and debonding processes for advanced semiconductor wafer-level packaging. The role involves process development, DOE execution, defect troubleshooting, and integration of multi-step packaging flows in a cleanroom R&D environment.
ResearchOnsiteInstitute of Microelectronics
Key Responsibilities
- Developing and optimizing temporary bonding and debonding processes for wafer-level packaging
- Support integration of process flows, ensuring compatibility across multiple steps in advanced packaging including laser debonding and back grinding
- Investigate and resolve process issues and defects such as voids, warpage, and delamination
- Plan and execute Design of Experiments (DOE) for process development
- Collect, analyze data, and document findings in technical reports
Requirements
- Bachelor's degree in Materials Science, Mechanical Engineering, Physics, Chemistry, Electronics, or Electrical Engineering
- Experience in TBDB process development or advanced packaging technologies is an advantage
- Strong analytical and problem-solving abilities
- Good communication and teamwork skills
- Ability to work in a cleanroom environment and handle precision equipment