About the role
AI summarisedThis R&D Process Engineer role focuses on developing advanced etching processes for semiconductor devices. The engineer will design and optimize thin-film etch processes using novel precursors, conduct feasibility studies, and collaborate with teams to scale processes for manufacturing.
EquipmentOnsiteEngineering
Key Responsibilities
- Design and optimize thin-film etch processes using novel and commercial precursors for highly selective removal of dielectrics, metals, and complex material stacks in advanced semiconductor device fabrication.
- Conduct concept and feasibility R&D for plasma and thermal etch, including chemical formulations, process flows, and parameter optimization.
- Collaborate with business units and clients to optimize and scale etching processes for high-volume manufacturing.
- Troubleshoot and resolve technical challenges using structured root cause analysis, engaging cross-functional teams to implement solutions.
Requirements
- Ph.D. in Materials Science, Chemistry, Physics, or Engineering with a strong emphasis on etch processes.
- Strong understanding of Conventional and Atomic Layer Etch (ALE) processes, plasma etching principles, and semiconductor device fabrication.
- Expertise in Si and Metal precursor-based ALE techniques, thin-film etch, and characterization for Memory and Logic devices.
- Solid knowledge of chemistry and chemical reactions in plasma/thermal environments and ability to correlate etch parameters with device performance.