About the role
AI summarisedLead projects from initiation to closure within the semiconductor assembly and packaging development domain, driving successful outcomes through cross-functional team leadership and expert stakeholder management.
IDMOnsiteBE
Key Responsibilities
- Plan, manage, and control the entire project life cycle to ensure successful handover to sustaining function.
- Ensure successful project execution by continuously assessing progress, managing risks, and driving the team to resolve issues.
- Lead diverse cross-functional teams to deliver and achieve defined project objectives.
Requirements
- Minimum 5 years of working experience in semiconductor assembly and packaging development.
- Minimum 2 years' experience leading end-to-end project management cycles.
- Bachelor Degree in Electronics, Industrial Engineering, or a relevant discipline.
- Strong project management knowledge covering initiation, planning, and closing phases, including reporting and documentation.
- Proven ability to lead cross-functional teams with diverse thoughts and personalities.
- Strong stakeholder management skills, including effective presentation, negotiation, and influencing abilities.
- Proficiency in Agile methodologies and critical thinking to effectively mitigate project risks.