About the role
AI summarisedThe SMTS Integration Engineer leads the development and integration of advanced 2.5D and 3D heterogeneous packaging technologies at GlobalFoundries. This role involves driving process optimization, managing cross-functional projects, ensuring quality and compliance, and mentoring junior engineers. The position requires deep expertise in semiconductor packaging and strong leadership in a fast-paced, innovation-driven environment.
FoundryOnsite
Key Responsibilities
- Lead integration activities for 2.5D and 3D heterogeneous technologies across design, process, and manufacturing teams
- Provide technical guidance on 2.5D and 3D packaging processes, materials, and equipment
- Develop and maintain project plans, timelines, and budgets while coordinating cross-functional teams
- Drive development and optimization of interposer design, TSVs, die stacking, and thermal management processes
- Implement and monitor quality control measures to ensure product reliability and performance
Requirements
- Bachelor’s or master’s degree in electrical engineering, Materials Science, Mechanical Engineering, or related field
- Minimum of 10 years of experience in semiconductor packaging, with at least 5 years in a leadership role
- In-depth knowledge of 2.5D and 3D heterogeneous integration technologies including interposer design, TSVs, die stacking, and SiP
- Proven track record managing complex projects with cross-functional teams
- Strong analytical, problem-solving, and communication skills with ability to mentor junior engineers