About the role
AI summarisedJoin ASM International at the forefront of semiconductor innovation as a Process Engineer in Advanced Packaging. You will contribute to developing, optimizing, and characterizing thin-film and surface preparation processes that enable next-generation chip technologies, gaining hands-on experience in a collaborative environment.
EquipmentOnsiteProcess development
Key Responsibilities
- Support the development and optimization of semiconductor processes for advanced packaging applications, including thin-film deposition (ALD, PECVD, PVD, ECP) and surface preparation.
- Assist in planning and executing experiments using structured problem-solving and basic DOE concepts.
- Collect, analyze, and document experimental data to support process learning and improvement.
- Develop new films or processes for emerging packaging applications like hybrid bonding and perform advanced materials characterization.
- Collaborate with cross-functional teams (equipment engineering, applications, R&D) to support process integration.
Requirements
- Ph.D.s or Master's in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or a related field. Bachelor’s with strong research background considered.
- Academic, internship, or project experience in semiconductor processing, materials science, or microelectronics.
- Familiarity with at least one thin-film deposition or process technique (e.g., ALD, CVD, PECVD, PVD, electrochemical processes).
- Exposure to hybrid bonding concepts, surface preparation, or integration topics through academic projects.
- Basic understanding of experimental methods, data analysis, or statistical concepts.
- Exposure to materials or surface characterization techniques through university labs or projects (e.g., SEM, AFM, XRD, ellipsometry).
- Strong curiosity, learning mindset, and willingness to develop hands-on technical skills.
- Ability to communicate clearly and work effectively in a collaborative, multicultural environment.