About the role
AI summarisedWe are seeking a Staff Packaging Engineer to lead advanced package industrialization from NPI through HVM, driving DFM integration and manufacturing readiness with OSAT partners in multiple countries to ensure stable ramp, yield, quality, and delivery performance.
FablessOnsiteEngineering
Key Responsibilities
- Lead end-to-end industrialization of advanced package technologies from NPI through HVM readiness across external assembly/test manufacturing partners and foundry partners.
- Serve as the primary interface between package design/technology development and external manufacturing partners to ensure manufacturable architecture and clear DFM requirements.
- Manage outsourced manufacturing sites to ensure capability, capacity readiness, and process maturity for advanced packaging platforms.
- Drive yield, cycle time, quality, and delivery performance by leading defect reduction and yield improvement initiatives with site teams.
- Drive process control and continuous improvement using DOE/SPC/FMEA and data-driven root cause analysis for yield excursions.
- Partner cross-functionally with design, reliability, quality, and supply chain teams to align deliverables and execute program plans.
Requirements
- Bachelor’s or Master’s degree
- Strong advanced packaging process expertise and manufacturing/operations acumen.
- Proven ability to influence across global teams and external partners to deliver robust, scalable production.
- Experience in semiconductor packaging/assembly manufacturing or product engineering is preferred.
- Demonstrated success in NPI and ramp leadership, including supplier management and manufacturing readiness.
- Strong problem-solving skills using structured methods (DOE/SPC/FMEA/8D) and manufacturing data.