About the role
AI summarisedThe Assembly Process & NPI Engineer drives silicon bump and package assembly supplier management, backend process optimization, and new product introduction activities. This role involves defining assembly processes, monitoring systems, implementing improvements, and supporting cross-functional teams including design, test, production planning, quality, and suppliers to meet TQRDCEB goals. The position requires hands-on experience in advanced node packaging, supplier coordination, and technical documentation.
FablessOnsite
Key Responsibilities
- Drive and manage silicon bump & package assembly suppliers, backend processes and solutions to achieve aggressive TQRDCEB goals
- Work closely with package design & technology, test & product engineering, production planning, quality engineering & NPI teams
- Collaborate with assembly/substrate suppliers to support new product & technology introduction activities
- Define processes, monitor systems, manage process improvements and changes
- Provide day-to-day support to bump and assembly suppliers & internal planning, product and test engineering teams
- Plan, drive & implement improvement activities for continual improvement, 2nd sourcing, cost reduction & customer satisfaction
Requirements
- PhD / Master / Degree in Mechanical / Electrical / Electronics Engineering
- 7~12 years of relevant experience managing advanced node silicon bumping
- Experience with large body single & multi-chip (2.1/2.5/3D) package assembly
- Experience managing substrate & back-end suppliers and processes
- Hands-on experience in Product Life-Cycle Management - creating & maintaining Bill of Material structure, Process Documentation, Process Change Notification
- Experienced in project management, failure analysis tools, techniques and TQM
- Good analytical, problem-solving skills
- Flexible and agile
- Sound knowledge of applicable industry standards, quality systems, regulations
- Knowledge of prevailing and emerging silicon package & substrate technologies, bumping and assembly processes, materials and equipment
- Able to communicate with internal team members & external partners in various geographic locations
- May be required to travel from time to time at short notice
- Experienced AutoCAD user
- Knowledge of silicon & PCB fabrication, board assembly processes (added advantage)