About the role
AI summarisedThis internship focuses on evaluating the mechanical and thermal performance of advanced packaged semiconductor devices. The intern will work closely with engineering teams to design experiments, analyze results, and contribute to the development of robust packaging solutions.
FablessOnsiteStudent / Intern / Temp
Key Responsibilities
- Evaluate mechanical and thermal performance of advanced packaged semiconductor devices
- Design experiments to test device performance
- Contribute to the development of robust packaging solutions
- Support the growth of the Advanced Packaging Lab in Singapore
Requirements
- Able to work independently, has a good work attitude and willing to learn.
- Should have good communication and presentation skills.
- Pursuing or graduating within a year with an advanced degree (Master's or PhD) in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
- Strong analytical skills and experience with data analysis tools (e.g., MATLAB, Python, Excel).