About the role
AI summarisedThe TD Process Integration Engineer is responsible for developing and integrating new technologies across various technology nodes, including precision passive devices and advanced sensors. This role involves driving process development, executing and characterizing experiments, collaborating with cross-functional teams and customers, and ensuring technology qualification and release for production. The position requires a strong technical background in semiconductor processes, analytical skills, and the ability to thrive in a fast-paced, collaborative environment.
FoundryOnsite
Key Responsibilities
- Develop and integrate differentiated technologies across various technodes
- Define, develop, and implement new technologies
- Collaborate with support/module teams and customers
- Drive the development (design and process) of new technologies such as precision passive devices, advanced sensors, and niche products
- Execute and characterize experimental splits to optimize process margin and demonstrate functionality and manufacturability
- Involved in new products tapeout and setup in proto lots to demonstrate functionality
- Run DOE and design experimental split plans for various tape-outs/products
- Identify and resolve process integration, design issues, and related problems
Requirements
- Knowledge of silicon micro-fabrication processes (e.g., Lithography, Etch, PVD, CVD) is an advantage
- Good interpersonal skills, tactful, resourceful, possess initiative, and good presentation skills
- Strong analytical, presentation, and problem-solving skills using statistical tools such as JMP
- Ability to perform in a fast-paced and challenging environment
- Experience in scripting and automation languages is a plus
- Good attention to detail, well-organized, and a strong team player who can work well in a cross-functional team environment
- A Degree in Microelectronics/Electrical/Electronics/Chemical Engineering or Science in Physics/Material Engineering or related field
- Basic understanding of device physics, electrical characterization, and failure analysis