About the role
AI summarisedThe Package Health Engineer at Micron's Advanced Packaging Technology Development team will develop and execute package health monitoring, simulation, and characterization activities for high-performance memory products. This role involves DFT, data analysis, reliability testing, and collaboration with data scientists to build predictive models for package health.
IDMFull-timeHIG
Key Responsibilities
- Develop and implement DFT strategies for advanced packaging.
- Conduct simulations for mechanical, thermal, and electrical performance.
- Perform electrical and mechanical characterization of packages.
- Analyze test and field data to identify early indicators of package degradation.
- Collaborate with data scientists to build predictive models for package health.
- Support root cause analysis and corrective actions for reliability issues.
Requirements
- Bachelor's or Master's degree in Electrical Engineering, Materials Science, or related field.
- 2+ years of experience in semiconductor industry (complex products preferred), preferably in packaging, test, or reliability engineering.
- Hands-on experience with simulation tools and test equipment, working on package characterization, reliability testing or electrical failure analysis.
- Proficiency in statistics, data analysis and scripting (e.g., Python, MATLAB, JMP).
- Strong understanding of semiconductor packaging process, material interaction and properties.
- Good knowledge of DRAM or ASIC product testing, test architecture, and packaging fail modes.
- Experience with AI/ML tools or statistical modeling.
- Familiarity with JEDEC or other reliability standards.
- Strong problem-solving and documentation skills.