About the role
AI summarisedPrincipal Scientist role at IME focusing on heterogeneous integration and hybrid bonding for 2.5D/3D packaging. Leads R&D projects, mentors staff, and drives process optimisation and reliability characterisation for advanced semiconductor packaging technologies.
ResearchOnsiteInstitute of Microelectronics
Key Responsibilities
- Collaborate with senior staff, process integrators, and external partners to address technology roadmaps, process capability requirements, and business challenges
- Lead high-impact projects with manageable risks and mentor less experienced colleagues
- Conceive and plan projects involving new materials, advanced process integration approaches, and innovative concepts
- Research and develop advanced packaging technology such as flip-chip & hybrid bonding techniques for 2.5D and 3D IC applications
- Investigate and refine wafer bonding processes for interposer fabrication, inter-dielectric gap fill, and alignment accuracy, addressing critical factors such as warpage, bonding strength, and yield
- Optimise die bonding processes, including the selection of low-temperature organic and inorganic bonding materials, surface preparation, and bonding methods
- Conduct engineering experiments for process characterisation to drive quality and yield improvements
- Perform reliability characterisation of hybrid-bonded packages to ensure robustness and long-term performance
- Inspire and mentor talents in semiconductor technology, contributing to workforce development in the field
- Work with minimal supervision and should be a team player
Requirements
- Educational Background: PhD in Materials Science and Engineering, Mechanical or Chemical Engineering, Electronics, Electrical and Computer Engineering, or a related field
- Experience: 0 to 5 years of experience in microelectronic devices, circuits, and hybrid component integration, 2.5D/3D heterogeneous integration applications
- Technical Expertise: knowledge in hybrid bonding or flip chip bonding is plus
- Knowledge: Strong knowledge of hybrid bonding equipment technologies and bonding materials and methodologies, and reliability characterisation is preferable
- Skills: Strong analytical and problem-solving skills. Proficiency in data analysis and interpretation and design of experiments
- Excellent written and verbal communication abilities
- Teamwork: Ability to work collaboratively in a research-oriented environment (OEMs, customers, and Internal stakeholders). Demonstrated ability to manage multiple tasks and projects simultaneously
- Demonstrated expertise in heterogeneous integration, hybrid bonding, and advanced packaging processes
- Proven ability to troubleshoot and resolve process-related challenges