About the role
AI summarisedSenior/Principal Process Integration Engineer at Micron Technology, responsible for designing and integrating process solutions for next-generation 3D NAND products in the Singapore R&D department. The role involves leading cross-functional teams to improve yield and quality, developing integration schemes, and transferring technology from R&D to manufacturing.
IDMFull-timeSTPG
Key Responsibilities
- Identify and quantify key module deficiencies and technology gaps. Lead cross-functional teams to address these issues. Improve current process flows and develop innovative solutions to meet product requirements and manufacturability.
- Develop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capability.
- Coordinate activities at the manufacturing site to secure funding for experiments, and conversions, and optimally communicate decisions to relevant R&D, Product Engineering, and Manufacturing partners.
- Undertake development projects to evaluate and implement new integration schemes for alpha and derivative part types. Establish proof of concept for future tech nodes at the manufacturing facility.
- Take on a leadership role at quarterly yield summits and monthly program reviews to summarize complex problems, explain actions taken to address them, and align R&D, Manufacturing, and senior management teams.
- Assist in the transfer of new technology from R&D to manufacturing. Contribute to ensuring a successful ramp-up and qualification. Support the transfer, documentation, and training of module fundamentals into manufacturing.
Requirements
- Passionate about semiconductor technology and innovation.
- Adept at data analysis, problem-solving, and process integration optimization.
- Excellent communication skills and ability to work in cross-functional teams.
- Minimal of 2 years of experience in the semiconductor industry.
- Proficiency in data analysis, visualization or simulation software, such as JMP, Tableau is desirable.
- Ability to develop a strong holistic end-to-end understanding of PI modules on new NAND technologies and related structural & electrical fail mechanisms.
- In-depth knowledge and direct experience with non-volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues are desirable.
- Experience in semiconductor R&D product life cycle from design to manufacturing is desirable.
- Ability to be self-motivated, and self-governing with proven ability to work in a demanding & dynamic environment.
- Display Micron Value of People. Innovation, Tenacity, Collaboration and Customer Focus.
- BS, MS/PhD in Material Science, Electrical Engineering, Microelectronics, Chemical or Physics Engineering, or a related field.